Intel says initial Light Peak builds will be copper

Intel recently confirmed that its Light Peak interconnect technology is ready for deployment.

However, Intel VP David Perlmutter told IDG News that initial Light Peak builds will be based on copper, rather than fiber optics tech as was first announced in 2009.

“The copper came out very good, surprisingly better than what we thought,” said Perlmutter. 

“[And as you know], optical is always a new technology which is more expensive.”

According to Perlmutter, copper is definitely good enough for the majority of current user requirements.

Nevertheless, he conceded that data transfer rates were definitely faster over fiber optic materials, which would eventually be rolled out by vendors in future Light Peak iterations.

Indeed, Intel originally announced that the transfer standard would exploit light to optimize data transfers between mobile devices and PCs at a speedy rate of 10 gigabits per second over distances of up to 100 meters.

Perlmutter also commented on the somewhat uneasy relationship between USB 3.0 and Light Peak, but noted that Intel’s new standard was unlikely to oust the classic transfer protocol.  

“USB 3.0 already has a traction in the market. I don’t know if that will change.

“[Really, you should] look at [Light Peak] as a medium by which you can do things, not necessarily as one replacing the other,” he added.