Intel is reportedly prepping a new Atom chip architecture that “goes beyond” the company’s recently introduced 3D Tri-Gate transistors.
Dubbed “Silvermont,” the next-gen chipsets are slated to launch and ship in 2013.
According to Brooke Crothers of CNET, Silvermont adds a “spanking new” architecture on top of the already advanced 3D transistor structure.
“When coupled with the 3D transistors, Silvermont is expected to enable new levels of integration and performance and make major strides in power efficiency,” he explained.
Although detailed specs have yet to be released, industry sources told Crothers Silvermont will be a 22-nanometer SoC.
It should be noted that Atom chips are currently shipping at 45-nanometer, but will move to 32-nanometer (in volume) in late 2011.
Silvermont – which is expected to offer lower power consumption and enable longer battery life – could help Intel with its efforts to compete in the lucrative smartphone and tablet markets.
