Major player Qualcomm said it has started sampling the first chipsets to support dual carrier HSPA+ and multi-mode 3G/LTE.
It said that its MDM9600 and MDM9200 chipsets will allow mass market commercial deployment of two nextgen network technologies for better data capabilities for mobile devices.
LTE – which stands for long term evolution – is supported by a large number of network operators, infrastructure vendors and handset manufacturers. Commercial launches of these devices using Qualcomm chipsets will begin during the second half of 2010.
Potential customers include Japan’s Emobile and Telstra, while Qualcomm is also working with Huawei, Novatel, Sierra Wireless and LTE.
Telstra will begin deploying dual carrier HSPA+ tech in the Next G network by the end of this year.
Novatel Wireless said it is evaluating the Qualcomm chipsets. It will deliver a large range of HSPA+ and LTE wireless modems and modules.
MDM 9200 supports UMTS, HSPA+ and LTE, while the MDM 9600 supports CDMA 2000, EV-DO Rev B, SV-DO, SV-LTE, UMTS, HSPA+ and LTE.
They can support orthoganal frequency division multiple access with peak rates of 100Mbps on the downlink and 50Mbps on the uplink.