NEC and Toshiba have extended tech development agreements with Big Blue to create a 28 nanometer high-k metal gate low power chip technology.
IBM has a large technology alliance to create 28 nanometer CMOS technology with Globalfoundries, Chartered Semi, Infineon, NEC, Samsung, ST Microelectronics and Toshiba. The work is centered around IBM’s East Fishkill fab.
The alliance has already created 32 nanometer high-k metal gate tech and said that the 28 nanometer shift doesn’t need major redesigns for a migration.
The goal is to create low power technology aimed specifically at consumer electronics, including mobile technologies, and the automotive market.
The alliance does not include Intel, which pursues its own process and fab plans, and is shifting to 32 nanometer technology later this year.
