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AMD targets consumer apps with new lidless BGA Sempron packaging

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AMD targets consumer apps with new lidless BGA Sempron packaging

Sunnyvale (CA) – AMD announced today the immediate availability of AMD Sempron 200U and 210U processors for embedded systems. The new CPUs come in a lidless Ball Grid Array (BGA) package which significantly reduces the footprint and expense over the traditional AMD socket.

Buddy Broeker, AMD’s directory of Embedded Product Marketing, is looking to push these processors into the retail touch screens, self-service kiosks and digital signage products. He says, “These new lidless BGA packaged processors can help customers significantly shrink their embedded design into new smaller, flatter form factors without having to sacrifice any computing performance.”

AMD says they’ve lined up Wyse, iBASE, aValeu, EVOC, Gigabyte and Invetec as embedded system designers planning to release products based on the new form factor. AMD will support the form factor for five years, as is standard for embedded components.