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Intel shrinks chip packaging

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Intel shrinks chip packaging

Intel has announced a new chip package which is 50 percent smaller than the standard Thin Small Outline Package (TSOP) currently used to house chips.

Called Easy BGA (for ball grid array), the new package measures 10mm by 13mm, with an 8mm-by-8mm pinout.

Intel plans to begin shipping the new package with its Fast Boot Block flash memory.

More about the Intel Flash solutions can be found at http://developer.intel.com.

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