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IBM unveils new packaging, research lab

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IBM unveils new packaging, research lab

IBM has unveiled a new chip packaging technology, and a new lab dedicated to refining the process of etching circuits onto silicon wafers.

IBM and Photronics, a specialist in the lithography process, plan to develop a new mask technology for chipmaking. The project will be completed at the new Mask Center of Competency, which will be located at IBM’s Burlington, Vt., manufacturing facility.

Separately, a new packaging technology from IBM promises to improve the longevity and performance of semiconductors used in the routers, switches and servers that form the backbone of the Internet.

The new High Performance Chip Carrier is designed to double the field life of chips that are encased within the new technology, according to IBM officials.

The full story appears at www.zdnn.com.

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