VIA and S3 unveil product roadmap

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VIA and S3 unveil product roadmap

VIA Technologies and S3 Inc. formalized their alliance by establishing a joint venture tasked with bringing integrated graphics and core logic chip sets to the volume OEM desktop and notebook PC markets.

Tentatively named S3-VIA Inc., the newly formed company is scheduled to ship its first joint product in early 2000, with samples due this quarter.

The venture has already begun work on its next-generation designs, including an integrated mobile chip set based on S3’s Savage/IX architecture, a higher performance integrated desktop chip set based on S3’s Savage2000 architecture, and several AMD K7 designs.

The joint venture is also pursuing the acquisition of companies or technologies that allow it to build a dominant position in the integrated OEM component market.

Details of the announcement are posted at www.via.com.

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