Hitachi Ltd. and United Microelectronics Corp. have announced a joint venture to manufacture 300mm wafers with leading-edge process technologies of 0.18-micron and beyond.
The new company will be based in the N3 building of Hitachi’s LSI manufacturing operation in Hitachinaka-city, Ibaraki prefecture, Japan. The site is expected to become a strategic manufacturing facility for both companies, combining Hitachi’s advanced process and manufacturing technology with UMC’s advanced technology and foundry expertise.
Half of the capacity of the joint venture will be reserved for Hitachi’s products, with the other half reserved for products supplied to UMC’s foundry customers. The joint venture will be established by the end of February 2000 and start manufacturing operations in 2001.