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Asia Pacific Microsystems takes over Winbond 5" fab

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Asia Pacific Microsystems takes over Winbond 5" fab

Asia Pacific Microsystems CEO and president Min-Shyong Lin announced that on July 1 the company officially took over the 5″ Fab 1 of Winbond Electronics. It also has purchased three ion implanters. After converting the fab’s lines to 6″ production, Asia Pacific Microsystems will begin operations in October, Lin said. The company will also launch its first product, a radio frequency (RF) module, in October.

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