Overview of new packaging technologies

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Overview of new packaging technologies

Demand from end-user application markets drives the development of new packaging technologies. For instance, mobile phones drove the development of stack packaging and PCs and game consoles that of flip chip packaging. Similarly, the rise of DRAM transmission speeds and improvements in wafer process technology will lead flip chip chip scale packaging (FC CSP) to become the main packaging technology for DRAM. In opto-electronics, specialized ICs such as those used in MEMS and DWD are also demanding innovations in packaging technology

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