Close

VIA Takes Delivery of One Millionth Wafer from TSMC

Share on facebook
Share on twitter
Share on linkedin
Share on whatsapp
VIA Takes Delivery of One Millionth Wafer from TSMC

VIA today received its one millionth semiconductor wafer from its major foundry partner, Taiwan Semiconductor Manufacturing Company Ltd. (TSMC). “Long established as a market and technology leader with its high performance core logic chipsets, VIA has also shipped millions of processors and was first to market with TSMC’s leading edge 0.13 micron technology; the latest processors ship with operating speeds of up to 1GHz and beyond, with power consumption as low as 6 watts.”

Read the entire press release.

Author